Locations: Dallas, Texas: Shanghai/Shenzhen, China: Bangalore, India
Job Type: Full Time
Nebula Microsystems Incβs mission is to deliver intelligent and high-performance Analog Products for a wide variety of applications to meet our worldwide customer requirements. Our solutions are focused on β but not limited to β Signal Chain and Power Applications for major markets with our expertise highlighted by extensive years of product developments. Our international team is located in technology-focused areas that provide the technical talent required for this industry. Nebula Microsystems is seeking an experienced Power or High-Speed IC Test Engineer to be part of a team of industry experts to incorporate product differentiation for customers.
Requirements :Β
β’ Bachelorβs degree (or higher) in Electrical Engineering with a minimum of 10 years of IC Test experience
β’ Knowledgeable of Power and/or High Speed ATE test strategies, requirements and board development
β’ ATE experience on Mixed Signal Testers β HP/Agilent, Teradyne Eagle, V93K or equivalent testers
β’ Production test program and hardware development knowledge of test fixture related items: handlers, socket, probe card, load board, docking plate, etc
β’ Knowledgeable in production control processes, data analysis/interpretation, GR&R, Cp/Cpk and correlation analysis
β’ Experience with typical system IO and management buses (SWD, JTAG, SPI, SPMI, I2C, UART, MIPI, etc.)
β’ Experience with OTP, MTP, EEPROM, EFLASH trimming, Fuse and DFT Pattern debug (ATPG Scan, memory BIST)
β’ Strong understanding of the IC product development process, from concept to volume production especially in the areas of yield improvement and test time reduction
β’ Data analysis skills using Spotfire, DataPower, Excel or equivalent
β’ Ability to work in teams and collaborate effectively across organizational functions and geographical regions in a fast-paced and rapidly changing environment
β’ Strong verbal and written communication skills
β’ Willing to travel internationally to test vendor sites in Asia (25%)
β’ Multilingual is a plus
Responsibilities
β’ Work with IC Design team to understand product specifications and to implement design-for-test and BIST methods during the product design development stage
β’ Develop calibration, verification, characterization and mass production test solutions for wafer, package, module and SIP (system in package) level products
β’ Work closely with supply-chain partners and external vendors on test coverage, test fixture design and test program implementation and optimization methods as well as custom package developments
β’ Provide ATE support for IC characterization, bring up, maintenance and failure analysis β’ Generate test plans, create test and characterization programs and design ATE hardware interface boards β’ Debug silicon on ATE and support performance correlation activities for product release β’ Perform statistical analysis of yield fallout, debug and fix yield issues β’ Support IC product qualification & characterization activities including qual hardware development and tri-temp testing requirements
β’ Support cross-functional teams with on-site development activities including planning, bring-up, test and debug
β’ Drive test issue resolution and close potential test gaps throughout the supply and manufacturing chains